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Lotus Materials

DeepTechSemiconductor MaterialsB2B📍 Incheon, South Korea

Lotus Materials, a startup spun out of Inha University, develops advanced metal bonding materials for next-generation power semiconductor chips. Their product, NanoSponge Ag, utilizes a nano-porous silver material to reduce bonding layer thickness significantly. This funding will accelerate technology advancement and commercialization, aiming for global competitiveness in the semiconductor materials market.

Total raised
Undisclosed
tracked to date
Latest round
USD 1.5 million
Oct 30, 2026
Known investors
2
led by Incheon University Youth Startup Fund

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Funding history

  1. 1
    USD 1.5 millionOct 30, 2026

    Led by Incheon University Youth Startup Fund

    Announcement ↗

Founder

S
Seungkyun Hyun
CEO

Investors in Lotus Materials

Backers from this company's tracked funding rounds.

  • IIncheon University Youth Startup FundLead investorVC firm
  • IIncheon Innovation Mother FundVC firm

Lotus Materials in the news

Coverage of this company's funding, tracked by Datapile.

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