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Malaysian Startup Raises US$2 Million To Tackle AI Chip Heat Bottleneck - BusinessToday Malaysia
A Malaysian startup has raised US$2 million to address the heat bottleneck in AI chip technology. This funding aims to enhance the performance and efficiency of AI chips, which are critical for various applications in the tech industry.
Malaysian Startup Raises US$2 Million To Tackle AI Chip Heat Bottleneck BusinessToday Malaysia
| Aug 31, 2026 | Boost | $20.0M | — | Malaysia |
| Aug 14, 2026 | BLOX | $1.0M | Seed | Malaysia |
| Jun 16, 2026 | Respond.io | $62.5M | Series B | Malaysia |
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