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Backed by Incheon University Youth Startup Fund, Incheon Innovation Mother Fund · verified emails and LinkedIn on Datapile
Inha University Spinout Lotus Materials, Developer of Power Semiconductor Bonding Material, Raises USD 1.5M - Wowtale
Lotus Materials, a startup spun out of Inha University, develops advanced metal bonding materials for next-generation power semiconductor chips. Their product, NanoSponge Ag, utilizes a nano-porous silver material to reduce bonding layer thickness significantly. This funding will accelerate technology advancement and commercialization, aiming for global competitiveness in the semiconductor materials market.
Inha University Spinout Lotus Materials, Developer of Power Semiconductor Bonding Material, Raises USD 1.5M Wowtale
| Oct 30, 2026 | FuriosaAI | $620.0M | Series D | South Korea |
| Oct 29, 2026 | NanoForge AI | $12.2M | Seed | South Korea |
| Oct 20, 2026 | Upstage | $30.2M | Series C-2 | South Korea |
| Oct 18, 2026 | rx | $7.5M | Bridge | South Korea |
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